Infinipoint Technologies Synopsys VLSI Expert
6-Week Intensive Training Program

CHIP TAPEOUT

From Zero to Silicon

Learn the End-to-End RTL-to-GDSII Tapeout Flow

Build Real Chips. Build Your Future.

6 Weeks Training
24/7 Tool Access
36+ Hours Live Sessions

This Program Is For You, If You...

Final Year Students

Get industry-ready for placements in July/August with hands-on chip design experience and real-world projects.

3rd Year Students

Build your final year project with real industry exposure and strengthen your technical profile.

Career Changers

Transition into the semiconductor industry with structured learning and expert mentoring.

Fresh Graduates

Build practical skills, work on real-world projects, and become job-ready in VLSI design.

Ambitious Minds

If you want to create, innovate, and make an impact in semiconductors – this is your launchpad.

Tech Enthusiasts

Dive deep into cutting-edge VLSI technology and master the complete RTL-to-GDSII flow.

What Makes It Impactful?

End-to-End VLSI Flow (RTL to GDSII)
Synopsys Tools – 24×7 Access
Live Sessions – 6 Hours Daily
Reference Materials & Resources
Recorded Sessions for Review
Certificate of Completion
Industry Expert Mentors
Hands-on Lab Practice

Program Details

6-Week Intensive VLSI Training

Start Date

1st June 2026 (Monday)

Day 0 Session

31st May 2026 (Sunday)

Schedule

6 Days a Week

Daily Duration

3 hrs + 3 hrs (Live Sessions)

Total Duration

6 Weeks + 2 Weeks Project Support

Mode

Online

Who Can Apply?

  • M.Tech – 1st & 2nd Year
  • B.Tech – 2nd, 3rd & 4th Year
  • Passout Freshers / Job Seekers
  • Career Changers

Investment

₹20,000 + GST
LIMITED SEATS

Week-Wise Curriculum

Comprehensive learning path from fundamentals to advanced tapeout

  • Tool access & login setup
  • Environment configuration
  • Synopsys tool launch (DC, Fusion Compiler, VCS, Verdi, PrimeTime, StarRC)
  • Lab infrastructure walkthrough

VLSI Flow Introduction (RTL to GDSII)

  • RTL → GDSII flow (Frontend & Backend)
  • Flat design flow (single-level netlist)
  • Hierarchical design flow (block partitioning, scalability)
  • Logic synthesis overview
  • Timing optimization basics
  • Floorplan, power plan, placement, routing overview

PDK & Input/Output Files (PDK Demystified)

  • LIB (.lib), LEF/DEF
  • Verilog & gate-level netlist
  • SDC, SDF, SPEF
  • SPICE netlist, UPF (power intent)
  • Tech file, ITF, TLU+, NXTGRD

UNIX, TCL & Scripting

  • UNIX fundamentals: File system, permissions
  • Commands: grep, awk, sed
  • Shell scripting basics
  • TCL scripting: Variables, loops, procedures
  • Usage in Synopsys tools (DC, ICC2, Fusion Compiler)

Digital Design using Verilog

  • Combinational vs Sequential logic
  • Verilog HDL: Syntax, data types, operators
  • RTL design methodology
  • Flat vs Hierarchical RTL

CMOS Fundamentals & Fabrication

  • Semiconductor fundamentals
  • MOSFET operation (NMOS/PMOS)
  • CMOS inverter: VTC, noise margins
  • Fabrication flow: Lithography, implantation, metallization
  • PVT corners

Circuit Design & Layout

  • CMOS logic design: Pull-up/pull-down networks
  • Stick diagrams
  • Layout fundamentals: Poly, diffusion, metal layers
  • Design rules (lambda-based)
  • Parasitic effects (RC delay)

Verification Concepts

  • DRC / LVS
  • SPICE simulations

STA Fundamentals

  • Input/output formats (LIB, LEF, DEF, SDC, SPEF)
  • Timing paths & delay modelling
  • Timing arcs & LIB understanding
  • Setup/Hold checks
  • Clock concepts: Skew, latency, jitter
  • SDC constraints & Timing closure basics

Low Power & Multi-Domain Design

  • Dynamic vs static power
  • Clock gating, power gating, Multi-Vt cells
  • Multi-Domain Design: Voltage & Clock Domains
  • CDC (Clock Domain Crossing) & Metastability

Logic Synthesis (Design Compiler → Fusion Compiler)

  • Flat vs Hierarchical Design Flow
  • RTL to gate-level mapping
  • Optimization techniques: Area, timing, power trade-offs
  • Technology mapping and libraries

Floorplanning

  • Utilization, aspect ratio
  • Macro placement
  • Block-level & SoC level floorplanning
  • Pin placement & Flylines

Power Planning

  • Power rings, stripes, mesh
  • Macro connections
  • Multi-voltage domains

Placement

  • Standard & physical-only cells
  • Tap, tie, endcap cells
  • Global placement & legalization
  • Congestion handling

Clock Tree Synthesis (CTS)

  • Clock Skew, jitter, latency
  • H-tree, mesh structures
  • NDR Rules
  • Concurrent optimization

Routing

  • Global & detailed routing
  • Routing tracks & pitch
  • Congestion challenges

Parasitic Extraction

  • RC modelling
  • SPEF generation
  • TLU+, NXTGRD concepts

Timing Signoff (PrimeTime)

  • Advanced STA concepts
  • Signal integrity (crosstalk)
  • ECO-based timing fixes

DFM & Tapeout

  • Manufacturability basics
  • Tapeout checklist
  • Final GDSII generation
  • Full Flow Execution: RTL → GDSII integration, Hierarchical design execution
  • Debugging & Optimization: QoR improvement, Timing & congestion fixes
  • Mentor Reviews: Design validation, Flow corrections
  • Project Closure & Optimization
  • Reporting & Documentation
  • Interview Readiness: Mock interviews, Resume preparation
  • Final Evaluation: Project review (RTL → GDSII), Technical viva

Ready to Build Real Chips?

JOIN NOW. DESIGN TODAY. TAPEOUT TOMORROW.